Course Details
- Course Code: OS-TT-CLBGA-2D
- Mode of Delivery: Onsite
- Duration: 2 Days
- Price: On Request
Introduction to Chip Level Practice and BGA Reballing
Course Overview
The course includes an induction session to welcome and orientate the candidate, and familiarize them with the training centre, health and safety requirements and other important policies and procedures. The training consists of a mix of classroom and workshop sessions and various assessments. Upon successful completion, the candidate will learn and understand chip level servicing and BGA reballing.
The course is designed for anyone to understand chip level service.
The candidate should have basic knowledge and skills in electronics.
Upon completing the training course, candidates will be awarded a ‘Certificate of Attendance’ attested by the Ministry of Manpower from NTI.
Other Details
- Semiconductor Fundamentals
- Mobile phone block diagram
- Normal soldering practice
- Hazard identification and risk assessment mob lab
- General Risks and solutions in mobile repairing-ESD, SAW, SURGE AND FILTERS
- Hand Tools -Tweezer, openers, screw driver kit
- Equipment - Hot air blower , soldering iron , DC power unit
- Microscope and types
- Micro Soldering
- Jumbering
- Introduction and study of Printed Circuit Board (Motherboard).
- Details of surface mount technology
- Semiconductor Fundamentals
- Study of different ICs (chips)
- Memories in mobile phone
- Identification of ICs
- Prepare open, short and closed circuit in PCB
- Chip level practice
- IC reballing
By the end of the module the candidate will be able to:
- Describe safety in mobile phone servicing
- Describe basics of electronics
- Identify different mother boards
- Perform SMD rework
- Identify equipment and tools
- Chip level practice
- Perform IC reballing
This course can be delivered onsite.